Diamond Layers Promise Cooler 3D Chips
Engineers are turning to industrial diamond to solve one of computing’s toughest problems: getting heat out of stacked chips. The approach could cut power use, speed up signaling, and lift…
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Signaling a major change in emergency policy, President Trump said he wants states to take…
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Drug Trial Vetting Ties Spark Safety Concerns
As pharmaceutical companies accelerate clinical research, questions are growing about who checks the data and…
Ice Around Baby Star Offers Clues
Scientists say they have captured their clearest view yet of ice surrounding a newborn star,…
Live Science Highlights Earth’s Strangest Animals
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